Solutions for Vapour Phase

Designed for manufacturing and EMS providers looking for the ultimate in thermal profiling, the SolderStar Pro package takes profiling capability to the highest level and provides true process profiling for optimum quality control.

The SolderStar Pro includes the ultra compact Neptune SL datalogger with unique ‘SmartLink’ connector system. ‘SmartLink’ allows high measurement channel configurations, while maintaining a small footprint and connection to a range of accessories for capture of SPC information from both reflow and wave soldering processes. A comprehensive suite of full- feature software includes profile simulations and integrated SPC charting tools.

This easy to use system is ideal for manufacturers and EMS providers who profile periodically to form a complete mass soldering quality control tool.

System Advantages

SolderStar PRO datalogger provides industry-leading accuracy, slim-line footprint and full lead-free thermal performance.
Up to 16 measurement channels for thermal profiling of the most complex PCB assemblies.
Unique SmartLink connection system provides easy and flexible connection to a range of products and accessories.
Professional software tools including thermal profile analysis and simulation, ISO documentation and integrated SPC management software.
WaveShuttle PRO ready for advanced wave soldering analysis.
DeltaPRObe ready for reflow oven performance monitoring.

Vapour Phase Thermal Profiler

Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapour Phase machines allows engineers to understand and control their production vapour phases processes.

Vapour phase soldering is not a new process, and with advanced machines available it is common place where throughput is not the main concern. Like all production processes, without proper control, problems will occur such as tombstoning or component positioning problems due to overly aggressive vacuum settings. The Solderstar system is specifically developed to pass through the VP process with the electronic assembly to allow the engineer to measure and understand this process fully.

The Solderstar VP systems uses a specially developed two-piece protective shield, fully machined from aluminium this enclosure is both ‘O’ ring sealed and Teflon coated to maximise the protection of the measuring instrument while passing through this harsh environment process.

Low Impact Design

This aluminium design provides an extremely low mass solution, minimising any possible impact on the process temperatures. Once retrieved from the process, the hot shield can be opened and the instrument removed minimising the potential for instrument damage and reducing overall cool down cycle. Data captured can then be downloaded to a PC for analysis by the engineer.

An innovative 2.4Ghz telemetry link is optionally available for this system, a ‘self healing’ mesh network technology has been employed which allows data to be fed live from within the process chamber, even within the vacuum stage allowing for precision monitoring and setup of actual product temperatures.

System Features

Up to 16 measurement channels for thermal profiling of the most complex PCB assemblies.
Profile Batch or Inline Systems.
Suitable for machines with vacuum stages.
Low mass thermal shield provides minimal impact to process.
Teflon coating to resist Galden build-up.
Two piece shield design to allow faster cool down cycles.
USB Recharge & communications.
Live product temperatures via optional 2.4Ghz Telemetry Link.