TMT-HA050

The TMT-HA050 hot air tool can be used for the removal of surface mount components such as SOIC, QFP, PLCC and other similar devices.

• Digital display shows temperature and air flow.
• Light, portable, plug and use tool.
• Uses HTN Series Hot Air Nozzles.
• Convection heating allows low pressure hot air to focus on solder joints.

TMT-HA100

The TMT-HA100 hot air pencil is designed to remove and reflow small precision components, integrated circuits and other smaller devices.

• ESD safe design with integrated ground.
  Specialized for work on precision components.
  Uses HAP Series Hot Air Pencil Nozzles.
• High quality heating element ensures fast heat up and long heater life.

TMT-HA200

The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

• Auto sleep activated when hot air tool is placed in the holder.
• Lightweight and compact, takes up minimal table space.
• Large selection of high quality nozzles.
• Adjustable, easy to use temperature and air control knobs.

TMT-HA300

The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

• Digital display shows temperature and status.
• Airflow meter provides visual feedback of air flow.
• Large selection of high quality nozzles
• Adjustable, easy to use temperature and air control knobs.

TMT-HA600

The TMT-HA600 hot air tool uses a large diaphragm pump and a high power 1300W heater, designed to work on more difficult applications, in the removal and reflow of surface mount components.

• Fast heating and temperature recovery
• Simple controls allows easy adjustment
• Uses HTN Series Hot Air Nozzles
• Digital display with easy-to-adjust temp and airflow