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BGA Rework Stations

What is a BGA Rework Station?

A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs). These rework stations allow the technicians to remove defected parts, reinstall incorrectly placed parts or replace any missing part in the PCBs. Rework stations can also be used to work on PCBs with column grid array packaging, chip scale packages, quad flat packages, land grid arrays or other SMDs. Thus, BGA rework stations are frequently named SMD rework stations or surface-mounted technology (SMT) rework stations.

The features of each BGA rework station dictates the size of the PCBs that can be reworked and the types and volume of jobs that can be performed. For example, BGA rework stations without the split-vision functionality are best for entry-level jobs, while BGA rework stations with it are suitable for more complex jobs. Additionally, some rework stations have automated functions, while other require full manual work.

our products

All machines come fully self contained with their own internal air and vacuum unless otherwise specified.

 ZM-R7830A BGA Rework Station

The Zhuomao ZM-R7830A BGA Rework Station represents the
pinnacle of Nitrogen Capable Rework Systems. Its high-end capabilities are
particularly noteworthy for optimizing yield in Lead-Free Solder scenarios and
no-clean processes. This cutting-edge system excels in placing SMD components
of considerable size, up to 80mm, owing to its advanced high-resolution
motorized vision system.

Features:

  • Power  – AC 380V   50/60Hz
  • Total Power  – Max 6800W
  • Heater power – Top heater 800W, bottom 800W, IR 5000W
  • Servo Drive system (Panasonic) +Panasonic PLC+8” Touch screen
  • Temperature control  K-type (Closed Loop)
  • Positioning  V-groove, PCB support + laser automatic positioning
  • PCB size Max 470×550mm    Min 15×20 mm
  • BGA chip  Max 80×80mm      Min 2×2 mm
  • Dimensions  L890×W790×H1000mm
  • Sensors  4
  • Weight 140kg

Accessories Include:

  • 5 pcs nozzle set.
  • 2 different size component pick-up tubes.
  • Online training video’s.
  • On-Site installation & training is also available for an additional fee.

ZM-R7220A BGA Rework Station

The Zhuomao ZM-R7220A boasts a high-resolution Hot Air
Rework System that stands out for its ability to precisely place even the
smallest SMD components, accommodating sizes as diminutive as 2mm.

Features:

  • Manual/Stationary split Vision System
  • Places components from 2mm to 60mm
  • Fits Boards up to 412mm
  • Top heating Hot air of 1200W
  • Bottom heating Hot air of 1200W
  • IR Area heater composed of carbon fiber 2700W
  • One Thermocouple input

Accessories Include:

  • 5 pcs nozzle set.
  • 2 different size component pick up tubes.
  • Online training videos.
  • On Site installation & training is also available for an additional fee

ZM-R730A BGA Rework Station

The Zhuomao ZM-R730A BGA Rework Station stands as a
top-of-the-line rework system, showcasing exceptional capabilities in the realm
of electronic components rework. Great for larger boards up to 632mm wide.

Features:

  • Manual/Stationary split Vision System
  • Places components from 2mm to 60mm
  • Fits Boards up to 635 x 520 mm
  • PCB thickness 
  • Top heating Hot air of 1200W
  • Bottom heating Hot air of 1200W
  • Preheat Power 4800 W
  • 5 thermocouple input

Accessories Include:

  • 5 pcs nozzle set.
  • 2 different size component pick up tubes.
  • Online training videos.
  • On Site installation & training is also available for an additional fee

ZM-R8650A BGA Rework Station

The Zhuomao Zm-R8650C is a fully automatic visual alignment BGA rework station.
It is suitable for automatic visual placement of large PCB boards (such as 5G communication boards), several components packaging, automatic welding and automatic desoldering.
It can be combined with SAP/ERP to realize the temperature curve analysis with S/N as retroactive condition.

Features:

  • Power Supply AC380V±10% 50/60Hz
  • Heater power Top heater 800W, bottom 800W, IR 5000W
  • Total power 21.25KW Upper temperature zone(1.45KW ) Power Lower temperature zone(2KW) Other power(1.8KW) � Preheating temperature zone(16KW
  • PCB size 670x570mm(Max) ; 10x10mm(Min)
  • BGA Chip Size 100x100mm(Max) ; 1x1mm(Min)
  • IR Temp. Zone Size 645x524mm
  • Motion Control X/Y/Z
  • External Temp. Sensor 6 PCS
  • Control System Industrial PC+Servo motion control system
  • Display System 24" SD display
  • Alignment System SM pixels d1g1tal HD industrial camera+ 1.3M pixels Industrial camera with telecentric auto-correction alignment
  • Vacuum adsorption Full automatic
  • Alignment Accuracy ±0.0lmm
  • Temp. Control K·type thermocouple(closed-loop), intelligent temperature compensation system with accuracy up to ± 1° c
  • Feeding Device Semi-automatic
  • Positioning V-groove with universal fixture(shaped fixture can be customized)
  • Dimensions L 1235xW1215xH1850mm
  • Weight 660KG

Accessories Include:

  • PCB support fixture
  • BGA support frame
  • Nozzle
  • Vacuum Nozzle

ZM-R7830A BGA Rework Station

The ZM-R7830A BGA Rework Station stands out as a top-tier
Nitrogen Capable Rework System, proving particularly advantageous for elevating
yield in Lead-Free Solder applications and no-clean processes. This advanced
system is adept at placing SMD components of up to 80mm in size, thanks to its
high-resolution motorized vision system.

Features:

  • Power: AC 380V, 50/60Hz

    Total Power: Max 6800W

    Heater Power: Top heater 800W, bottom 800W, IR 5000W

    Control System: Servo Drive system (Panasonic) + Panasonic PLC + 8” Touch screen.

    Temperature Control: K-type (Closed Loop)

    Positioning: V-groove, PCB support + laser automatic positioning.

    PCB Size: Max 470×550mm, Min 15×20 mm

    BGA Chip Size: Max 80×80mm, Min 2×2 mm

    Dimensions: L890×W790×H1000mm

    Sensors: 4

    Weight: 140kg

Control System:

  • The rework station boasts an Industrial PC control system,
    offering versatility with various operating modes. It provides real-time display
    of temperature curves, allowing for more than 12 segments in each curve. The
    system can automatically save temperature curves, generating an abundance of
    log files for easy recall of historical parameters, ensuring traceability.

Temperature Management:

With three independently controlled temperature zones, the

system enables convenient and swift programming of temperature parameters. The
top zone utilizes ceramic heaters, employing a built-in vacuum tube for chip
adsorption. The electric control system facilitates 360-degree rotation
alignment, featuring pressure protection, dual over-temperature protection, and
alarm functions. The software design incorporates encryption and fool-proof
mechanisms.

Bottom Heating:

A bottom heating system adopts a medium-wave ceramic
infrared heating plate from Germany. This allows independent heating of the
bottom temperature zone with adjustable distance from the PCB. The system
excels in fast temperature control accuracy, effectively addressing PCBA
preheating and rework temperature challenges.

Optical Alignment:

Featuring an HD Optical Alignment Module, the system
includes an imported HD CCD (2M pixels) optical alignment system. The PC
control system automates X/Y movements for optical lens alignment. The setup
comprises a 15" HD industrial display (1080P 16:9) and an 18.5" SD
display for operation. An automatic feeding device is incorporated for seamless
feeding and receiving

Included Accessories:

5 pcs nozzle set.
2 different size component pick up tubes.
Online training videos.
On-site installation & training are available for an additional fee.

SV560 BGA Rework Station

With Shuttle Star SV 560 you can have:

High resolution HDMI vision System;

Fits up to 915 mm boards;

Able to rework heavy PCBs with many layers;

Places components from 1mm to 120 mm, with available upgrade for 0.22 mm and larger;

Component heater on the top side with 1200W, a component heater on the bottom with 800W and a Six-zone IR underheater with 3600W;

The color optical system is equipped with split vision, zoom, micro-adjust, auto-focus and software operation camera function with a high-definition camera;

High-definition LCD monitor;

Ready to plug in and use.

E6250U – Nitrogen Gas Capable

Ideal for high-yield, lead-free BGA rework of the largest circuit boards;

Fits Boards up to 915 mm;

High Resolution HDMI Vision System;

Uses compressed air or Nitrogen;

Places components from 1mm to 120mm;

Component heater on the top side with 1000W, a component heater on the bottom with 1000W and a six-zone IR underheater with 3600W;

Auto Pick and Place;

Motorized X, Y and Theta controls;

Joy Stick and Touch Screen Control;

Movable Bottom Spot Heater;

High-definition LCD monitor.

The entire head of the machine can move in an X and Y direction with touch sensitive magnetic locks.  The top and bottom component heaters move in conjunction with each other. This allows you the ability to easily rework components at any location including the edge of very large boards.

The color optical system has split vision, zoom and micro-adjust functions.

This model requires and external air source and Nitrogen can be used for the top heater air.

Benefits of BGA Rework Stations

BGA rework stations represent a significant investment, but they offer many benefits.

Accuracy: When doing a rework in a PCB the technicians need skill and attention to avoid damage. BGA rework stations provide the necessary tools to achieve the required precision, allowing the job to be completed with accuracy and safety, without damaging the entire device.

Efficiency: BGA rework stations include highly specialized tools, such as nozzles, solder balls and component pickup tubes, that ensure technicians to efficiently tackle the rework job.

Volume: With the right BGA rework station companies can handle a high volume of rework jobs on a variety of different-sized PCBs.

Cost: BGA rework stations are costly but an investment that pays off. Reworking PCBs can significantly extend their lifetime, which reduces costs on reassembling or new purchases.

Application Use for BGA Rework Stations

BGA rework stations have several different applications in the world of PCB repair and alteration.

Upgrades: BGA rework stations are very often used for upgrade works in which technicians need to swap out parts or add upgraded pieces to a PCB.

Faulty parts: Faulty parts frequently can be repaired with BGA rework stations. For example, pads damaged during BGA removal, heat-damage or too much solder joint voiding.

Faulty assembly: Several mistakes can occur during assembly which could be repaired with the help of a BGA rework station. For example, the PCB may have incorrect BGA orientation or a poorly developed BGA rework thermal profile.

Hot Air vs. IR BGA Rework Stations

BGA rework stations can integrate two types of systems to heat up the PCB components: hot air or infrared (IR) radiation.

Hot air BGA rework stations have several nozzles to guide and circulate the hot air, in order to ensure an even heat distribution. The technicians can direct the air by moving the nozzles, allowing a quick, dedicated work on small components. These machines require the use of air pumps, which brings some level of noise to the workspace. This is an older technology, thus many technicians are trained to use hot air BGA rework station as opposed to IR BGA rework stations.

IR BGA rework stations use IR radiation and a fixed ceramic heater to heat the PCB components. These machines are totally silent and involve fewer pieces. Depending on the quality of the BGA rework station, frequent maintenance and additional tools may be required to accomplish the desired jobs. Because this is a new technology, fewer technicians are trained to use these BGA rework stations.

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